SYS-111C-NR-G1

Single Intel® Xeon® 4510 (12C/2.4GHz)
128GB DDR5-5600
2x 960GB M.2 NVMe SSD
1 dual 10GbE RJ45
2x 860W Titanium Level

Key Applications
Virtualization 
HPC 
CDN, Edge Nodes 
Cloud Computing 
Data Center Optimized 
Storage Headnode 
Key Features
Single Socket E (LGA-4677) 4th/5th Gen Intel®  Xeon® Scalable processors. Up to 350W TDP 
Intel® C741 Chipset 
16 DIMMs; Supports 3DS DDR5 RDIMM. Up to 5600 MHz 
Dual AIOM (OCP 3.0) for networking (NCSI available), 1 dedicated IPMI LAN 
10x front hot-swap 2.5" SATA3 drive bays (Optional all 10 hybrid Gen5 NVMe), SAS3 with additional SAS controller card 
Redundant Now Titanium 860W Power Supplies 
Main Specifications
Device TypeUP SuperServer 
Built-in DevicesSuper X13SEDW-F 
Form Factor1U Rackmount - CSE-LB16TS-R0AWNP3 
Dimensions (WxDxH)Height 1.7" (43 mm) x Width 17.2" (437 mm) x Depth 23.5" (597 mm) 
WeightGross Weight: 40 lbs (18.1 kg) - Net Weight: 25 lbs (11.3 kg) 
GPU
Max GPU CountUp to 2 single-width GPUs 
Supported GPUNVIDIA PCIe: T1000, L4, A2 
Processor
Processor InstalledIntel® Xeon® Silver 4510 Processor 12-Core 2.40GHz 30MB Cache (150W) 
System Memory
Memory Installed2x 64GB DDR5 5600MHz ECC RDIMM Server Memory 
Drive Bays
Hard Drive Installed2x 960GB M.2 NVMe Solid-state Drive (SSD) 
On-Board Devices
Network ConnectivityDual 10GbE RJ45 (Installed) 
SATA/SASSATA (6Gbps) ; RAID 0/1/5/10 support 
NVMeNVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required) 
ChipsetIntel C741 
Input / Output
LAN1 RJ45 1 GbE Dedicated BMC LAN port(s) 
USB(s)2 USB 3.2 Gen1 Type-A ports(rear)
2 USB 2.0 Type-A ports(front)
 
Video Output1 VGA port 
System BIOS
BIOS TypeAMI 32MB SPI Flash EEPROM 
Power
AC Input Voltage100V to 240V AC 
Power Supply Installed2x 860W Titanium Level 
Environment
Operating Temperature5°C to 40°C 
Relative Humidity10% to 90% (non-condensing) 
Storage Temperature-40°C to 60°C 
$3,736.00