SYS-421GE-NBRT-LCC-G1

DP Intel 4U Liquid-Cooled System with NVIDIA HGX B200 8-GPU (complete rack and onsite service are required) 

Dual Intel® Xeon® 8570 (56C/2.1GHz)
NVIDIA HGX™ B200 8-GPU
2.3TB DDR5-4800
8x 3.8TB U.3 NVMe SSD
2x 1.92TB M.2 NVMe SSD
8x Single 400G NDR/ETH OSFP
1x NVIDIA BlueField®-3 DPU 200Gb/s
4x 6600W Redundant (2+2) Titanium Level

 

Key Applications
Scientific ResearchFinance Services and Fraud Detection
Conversational AIAI/Deep Learning Training and Inference
Business Intelligence & AnalyticsLarge Language Model (LLM) and Generative AI
Drug DiscoveryHigh Performance Computing (HPC)
Autonomous Vehicle Technologies 
Key Features
32 DIMM slots supporting up to 8TB of memory; RDIMMs up to DDR5-5600 
3 PCIe 5.0 x16 slots with support for GPU/Accelerator cards 
Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible) 
8x 2.5" hot-swap NVMe/SATA/SAS drive bays; Optional 4x 2.5" hot-swap NVMe/SAS/SATA drive bays; 2x internal M.2 NVMe/SATA drive slots; Optional RAID support via storage add-on card 
8 heavy-duty hot-swap fans with optimal fan speed control 
Main Specifications
Device Type

DP Intel 4U Liquid-Cooled System with NVIDIA HGX B200 8-GPU (complete rack and onsite service are required) 

 
Built-in DevicesSuper X13DEG-D 
Form Factor4U Rackmount 
Dimensions (WxDxH)Height 6.85" (174 mm)Width 17.6" (449 mm)Depth 35.25" (895.35 mm) 
WeightGross Weight: 227 lbs (103 kg) Net Weight: 191 lbs (87 kg) 
GPU
Max GPU Count8 onboard GPUs 
Supported GPUNVIDIA SXM: HGX B200 8-GPU (180GB) 
CPU-GPU InterconnectPCIe 5.0 x16 CPU-to-GPU Interconnect 
GPU-GPU InterconnectNVIDIA® NVLink® with NVSwitch 
Processor
Processor Dual Socket E (LGA-4677)
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
 
System Memory
   MemorySlot Count: 32 DIMM slots
Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM
 
Drive Bays
Hard Drive Default: Total 8 bays
8 front hot-swap 2.5" NVMe drive bays
2 M.2 NVMe slots (M-key)
 
On-Board Devices
Network Connectivity2 RJ45 10GbE with Intel® X710-AT2 
ChipsetSystem on Chip 
Input / Output
Video Output1 VGA port 
System BIOS
BIOS TypeAMI 32MB UEFI 
Power
AC Input Voltage5900W: 200-207.9Vac / 50-60Hz
6000W: 208-219.9Vac / 50-60Hz
6300W: 220-229.9Vac / 50-60Hz
6500W: 230-238.9Vac / 50-60Hz
6600W: 239-240Vac / 50-60Hz
 
Power Supply Installed
4x 6600W Redundant (2 + 2) Titanium Level (96%) power supplies
 
Environment
Environmental Spec
  • Operating Temperature: 10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
 
$350,656.00