Main Specifications |
Device Type | DP Intel 4U Liquid-Cooled System with NVIDIA HGX B200 8-GPU (complete rack and onsite service are required) | |
Built-in Devices | Super X13DEG-D | |
Form Factor | 4U Rackmount | |
Dimensions (WxDxH) | Height 6.85" (174 mm)Width 17.6" (449 mm)Depth 35.25" (895.35 mm) | |
Weight | Gross Weight: 227 lbs (103 kg) Net Weight: 191 lbs (87 kg) | |
GPU |
Max GPU Count | 8 onboard GPUs | |
Supported GPU | NVIDIA SXM: HGX B200 8-GPU (180GB) | |
CPU-GPU Interconnect | PCIe 5.0 x16 CPU-to-GPU Interconnect | |
GPU-GPU Interconnect | NVIDIA® NVLink® with NVSwitch | |
Processor |
Processor | Dual Socket E (LGA-4677) 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors | |
System Memory |
Memory | Slot Count: 32 DIMM slots Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM | |
Drive Bays |
Hard Drive | Default: Total 8 bays 8 front hot-swap 2.5" NVMe drive bays 2 M.2 NVMe slots (M-key) | |
On-Board Devices |
Network Connectivity | 2 RJ45 10GbE with Intel® X710-AT2 | |
Chipset | System on Chip | |
Input / Output |
Video Output | 1 VGA port | |
System BIOS |
BIOS Type | AMI 32MB UEFI | |
Power |
AC Input Voltage | 5900W: 200-207.9Vac / 50-60Hz 6000W: 208-219.9Vac / 50-60Hz 6300W: 220-229.9Vac / 50-60Hz 6500W: 230-238.9Vac / 50-60Hz 6600W: 239-240Vac / 50-60Hz | |
Power Supply Installed | 4x 6600W Redundant (2 + 2) Titanium Level (96%) power supplies | |
Environment |
Environmental Spec | - Operating Temperature: 10°C to 35°C (50°F to 95°F)
- Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
- Operating Relative Humidity: 8% to 90% (non-condensing)
- Non-operating Relative Humidity: 5% to 95% (non-condensing)
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