SYS-421GE-TNHR2-LCC-G1

Gold Series version with pre-configured components

  • CPU: Dual Intel® Xeon® 8570 (56C/2.1GHz)
  • GPU: NVIDIA HGX™ H200 8-GPU
  • Memory: 3TB DDR5-5600
  • Storage: 2x 960GB M.2 NVMe SSD
  • Networking: 8 single 400G NDR/ETH OSFP, 1 dual 200G NDR200/ETH QSFP112
  • Power Supply: 4x 5250W Titanium Level

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Key ApplicationsHigh Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics
Key FeaturesComplete liquid-cooled rack integration is required for purchase; 5th/4th Gen Intel® Xeon® Scalable processor support; Support for NVIDIA HGX H200/H100 8-GPU; 32 DIMM slots, up to 4TB 5600MT/s ECC DDR5 RDIMM (1DPC) or up to 8TB 4400MT/s ECC DDR5 RDIMM (2DPC); Up to 8 PCIe 5.0 x16 LP + 2 PCIe 5.0 x16 FHHL slots; Up to 8 front hot-swap 2.5" NVMe drive bays; 4 Redundant 6600W Titanium Level power supplies

 

 

 

Form Factor4U Rackmount Enclosure: 449 x 174 x 895.35mm (17.6" x 6.85" x 35.25")
Package: 1280 x 410 x 730mm (50.39" x 16.14" x 28.7")
ProcessorDual Socket E (LGA-4677) 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
Up to 64C/128T
Up to 320MB Cache per CPU
GPUMax GPU Count: 8 onboard GPUs
Supported GPU: NVIDIA SXM: HGX H100 8-GPU (80GB), HGX H200 8-GPU (141GB)
CPU-GPU Interconnect: PCIe 5.0 x16 CPU-to-GPU Interconnect
GPU-GPU Interconnect: NVIDIA® NVLink® with NVSwitch™
System MemorySlot Count: 32 DIMM slots
Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM
Drive Bays ConfigurationDefault: Total 8 bays
8 front hot-swap 2.5" NVMe drive bays
M.2: 2 M.2 NVMe slots (M-key)
Expansion SlotsDefault: 8 PCIe 5.0 x16 LP slots
2 PCIe 5.0 x16 FHHL slots
Option A: 8 PCIe 4.0 x16 LP slots
4 PCIe 5.0 x16 FHHL slots
On-Board DevicesChipset: Intel® C741
Network Connectivity: 2 RJ45 10GbE with Intel® X710-AT2
Input / Output1 VGA port
System CoolingFans: 4 Fan 8cm Fan(s)
Liquid Cooling: Direct to Chip (D2C) Cold Plate
Power Supply4x 6600W Redundant (2 + 2) Titanium Level (96%) power supplies
System BIOSBIOS Type: AMI 32MB SPI Flash EEPROM
ManagementSuperCloud Composer®; Supermicro Server Manager (SSM); Super Diagnostics Offline (SDO); Supermicro ThinAgent Service (TAS); SuperServer Automation Assistant (SAA)
PC Health MonitoringCPU: Monitors for CPU Cores, Chipset Voltages, Memory 8+4 Phase-switching voltage regulator
FAN: Fans with tachometer monitoring, Status monitor for speed control, Pulse Width Modulated (PWM) fan connectors
Temperature: Monitoring for CPU and chassis environment, Thermal Control for fan connectors
Dimensions and WeightWeight: Gross Weight: 227 lbs (103 kg)
Net Weight: 191 lbs (87 kg)
Available Color: Silver
Operating EnvironmentOperating Temperature: 10°C to 35°C (50°F to 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
MotherboardSuper X13DEG-M
ChassisCSE-GP403TS-R000NFP
$269,675.00