Main Specifications |
Device Type | DP Intel 4U Liquid-Cooled System with NVIDIA HGX B200 8-GPU (complete rack and onsite service are required) | |
Built-in Devices | Super X14DBG-DAP | |
Form Factor | 4U Rackmount | |
Dimensions (WxDxH) | Height6.85" (174 mm) Width 17.6" (449 mm) Depth 35.25" (895.35 mm)Package 16.14" (H) x 50.39" (W) x 28.7" (D) | |
Weight | Gross Weight: 236 lbs (107 kg) Net Weight: 203 lbs (92 kg) | |
GPU |
Max GPU Count | 8 onboard GPUs | |
Supported GPU | NVIDIA SXM: HGX B200 8-GPU (180GB) | |
CPU-GPU Interconnect | PCIe 5.0 x16 CPU-to-GPU Interconnect | |
GPU-GPU Interconnect | NVIDIA® NVLink® with NVSwitch™ | |
Processor |
Processor | Dual Socket BR (LGA-7529) Intel® Xeon® 6900 series processors with P-cores | |
System Memory |
Memory | Slot Count: 24 DIMM slots Max Memory (1DPC): Up to 6TB 6400MT/s ECC DDR5 RDIMM Max Memory (1DPC): Up to 6TB 8800MT/s ECC DDR5 MRDIMM | |
Drive Bays |
Hard Drive Installed | Default: Total 8 bays 8 front hot-swap 2.5" NVMe drive bays 2 M.2 NVMe slots (M-key) | |
On-Board Devices |
Network Connectivity | 2 RJ45 10GbE with Intel® X710-AT2 | |
Chipset | System on Chip | |
Input / Output |
Video Output | 1 VGA port | |
System BIOS |
BIOS Type | AMI 64MB UEFI | |
Power |
Power Supply Installed | 4x 6600W Redundant (2 + 2) Titanium Level (96%) power supplies | |
Environment |
Operating Temperature | 10°C to 35°C (50°F to 95°F) | |
Relative Humidity | 8% to 90% (non-condensing) | |